{"id":3283,"date":"2015-12-21T10:07:40","date_gmt":"2015-12-21T17:07:40","guid":{"rendered":"http:\/\/blogs.oregonstate.edu\/erlenmeyer\/?p=3283"},"modified":"2015-12-21T10:07:40","modified_gmt":"2015-12-21T17:07:40","slug":"plating-engineer-position","status":"publish","type":"post","link":"https:\/\/blogs.oregonstate.edu\/erlenmeyer\/2015\/12\/21\/plating-engineer-position\/","title":{"rendered":"Plating Engineer Position"},"content":{"rendered":"<p>NANO3D SYSTEMS LLC (NANO3D) is a fast growing start up company that develops novel micro- and nanofabrication plating technologies, products and services for semiconductor, clean energy, touchscreens and biomedical markets. By employing the brightest minds, NANO3D creates the innovations that shape the future of technology.<\/p>\n<p>&nbsp;<\/p>\n<p><strong>Job Summary<\/strong><\/p>\n<p>Plating Engineer works as a member of a team at NANO3D SYSTEMS LLC to develop, implement and maintain the micro- and nanofabrication plating processes. Bring passion and dedication to your job and there&#8217;s no telling what you could accomplish.<\/p>\n<p><strong>\u00a0<\/strong><\/p>\n<p><strong>Key Qualifications:<\/strong><\/p>\n<ul>\n<li>Minimum 2 years\u2019 experience in plating, specifically focused on improving \/ optimizing process chemistry and controls for electrolytic and electroless nickel, cobalt, iron, tin, copper, palladium and alloy plating.<\/li>\n<li>Extensive knowledge of plating processes, process chemicals and equipment as well as plating bath metrology.<\/li>\n<li>Strong material and metallurgical knowledge of metals, especially copper, tin, palladium, nickel, cobalt, iron and their alloys.<\/li>\n<li>Experience with the use of statistical tools and methods for determining process capabilities, troubleshooting problems, process controls and design of experiments (DOE).<\/li>\n<li>Ability to manage time to maximize productivity.<\/li>\n<li>Good team working and communication skills.<\/li>\n<li>Attention to detail and accuracy of recording information.<\/li>\n<li>Awareness of commercial importance of products and ability to plan and prioritize work accordingly.<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<p><strong>Key Responsibilities:<\/strong><\/p>\n<ul>\n<li>Develop and implement the novel micro- and nanofabrication plating technologies.<\/li>\n<li>Develop and optimize novel bath chemistries to obtain desired film properties, and to specify process parameters needed to scale the bath to industrial wafer plating tools.<\/li>\n<li>Prepare, characterize and optimize plating solutions; prepare and measure the film mechanical, microstructural, thermal, and chemical properties; and transfer of the process from benchtop cells to full wafer equipment.<\/li>\n<li>Participates in defect reduction teams and implements process improvements based on demonstrated improved yield results.<\/li>\n<li>Interfaces with other engineering, quality and manufacturing team members.<\/li>\n<li>Work to maximize productivity and meet targets and deadlines.<\/li>\n<li>Focus on Safety and environmental regulations.<\/li>\n<li>All other duties as required.<\/li>\n<\/ul>\n<p><strong>\u00a0<\/strong><\/p>\n<p><strong>Education:<\/strong><\/p>\n<p>BS or MS in chemical engineering, chemistry or material science.<\/p>\n<p>&nbsp;<\/p>\n<p><strong>Work Location:<\/strong><\/p>\n<p>MBI\/ONAMI in Corvallis, Oregon.<\/p>\n<p>&nbsp;<\/p>\n<p><strong>Contact information:<\/strong> dubin@nano3dsystems.com<\/p>\n","protected":false},"excerpt":{"rendered":"<p>NANO3D SYSTEMS LLC (NANO3D) is a fast growing start up company that develops novel micro- and nanofabrication plating technologies, products and services for semiconductor, clean energy, touchscreens and biomedical markets. By employing the brightest minds, NANO3D creates the innovations that shape the future of technology. &nbsp; Job Summary Plating Engineer works as a member of&hellip; <a href=\"https:\/\/blogs.oregonstate.edu\/erlenmeyer\/2015\/12\/21\/plating-engineer-position\/\">Continue reading <span class=\"meta-nav\">&rarr;<\/span><\/a><\/p>\n","protected":false},"author":3656,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[],"class_list":["post-3283","post","type-post","status-publish","format-standard","hentry","category-uncategorized"],"_links":{"self":[{"href":"https:\/\/blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/posts\/3283","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/users\/3656"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/comments?post=3283"}],"version-history":[{"count":1,"href":"https:\/\/blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/posts\/3283\/revisions"}],"predecessor-version":[{"id":3284,"href":"https:\/\/blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/posts\/3283\/revisions\/3284"}],"wp:attachment":[{"href":"https:\/\/blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/media?parent=3283"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/categories?post=3283"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.oregonstate.edu\/erlenmeyer\/wp-json\/wp\/v2\/tags?post=3283"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}