Jacob Dawes

About me:
After graduating with a BS in Electrical/Computer Engineering at OSU, I began my Master’s in order to delve further into my field and explore advanced/interdisciplinary topics such as lab-on-chip, integrated sensors, and microfluidics. My primary interest is in miniaturizing complex and otherwise bulky instrumentation to make it more widely available, efficient, and rugged – especially for use in medicine. After this degree, I intend on moving on to PhD.
I have interned at Biotrinik/MSEI, designing power supplies for medical implants and at HP in Corvallis, working with IC packaging and microfluidics.
Skills/Specialties:
  • System level design and miniaturization
  • PCB design (Eagle, KiCad)
  • Analog circuit design
  • Power supply/magnetics design
  • Embedded systems programming (mostly AVR)
  • Simulation (Spice, Cadence, MATLAB/Simulink)
  • Electronic test tools
  • Clean room fabrication (metal deposition, photolithography, mask design, materials selection, etc.)
  • Microfluidics design/basic structures

 

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